WitrynaSilicon photonics platform – imec. Imec’s silicon photonics technology ‘iSiPP’ is available on 200 and 300mm wafer sizes, including a wide range of active and passive devices. The interface for flip-chip DFB laser integration has been developed in imec’s iSiPP200N platform. In addition to high-speed electro-optic Si modulators, high ... Witryna19 gru 2024 · Earlier this year, imec engineers showed advantages for SRAM cells using buried power lines.SRAM, typically a 6-transistor circuit, is particularly sensitive to interconnect resistance, which can ...
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Witryna25 cze 2024 · Imec and UTAC have developed a unique process for the wafer … Witryna21 cze 2024 · Earlier, imec demonstrated new approaches for maintaining good gate … how to hit golf club irons
Engineers demonstrate the first flexible hardware platform for silicon ...
WitrynaPicture: imec www.europractice-ic.com Version 201015 – v6 Mini@sic Schedule 2024 … Witryna21 lip 2024 · Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of … Witryna13 kwi 2024 · April 13th, 2024 - By: Brian Bailey. While only 12 years old, finFETs are reaching the end of the line. They are being supplanted by gate-all-around (GAA), starting at 3nm [1], which is expected to have a significant impact on how chips are designed. GAAs come in two main flavors today — nanosheets and nanowires. how to hit golf driver straight